# Semiconductor Process Change Notification (PCN) Template > Source: https://netray.co/tools/semiconductor-process-change-notification-template > Publisher: Netray (netray.co), AI and integration engineering for ERP and manufacturing systems. > Section: Free Tools ## Short answer A customer-facing PCN document covering the change description, reason, qualification plan, affected part numbers and timeline. ## Category compliance-legal ## Industry Semiconductors ## Audience - Product engineer - Supplier quality engineer - Fab process integration engineer ## Tool **Kind:** template **Output:** document **Fields:** #### PCN number **Key:** pcn_no **Type:** text **Default:** PCN-2026-0142 #### Supplier / company **Key:** supplier **Type:** text **Default:** Acme Semiconductor Ltd #### Issue date **Key:** issue_date **Type:** date **Default:** 2026-10-19 #### Change type **Key:** change_type **Type:** select **Options:** - Wafer fab process - Wafer fab site transfer - Assembly site transfer - Assembly material (leadframe, mold compound, wire) - Test site or test program - Die revision or mask change - Packaging and shipping **Default:** Assembly material (leadframe, mold compound, wire) #### Affected part numbers **Key:** affected_parts **Type:** textarea **Default:** MCU-A2-QFN32, MCU-A2-QFN48, MCU-A3-QFN32 (all temperature grades) #### Description of change **Key:** description **Type:** textarea **Default:** Gold bond wire replaced with palladium-coated copper wire (25 um) on QFN assembly line at OSAT site B. No change to die, package outline or datasheet parameters. #### Reason for change **Key:** reason **Type:** textarea **Default:** Cost and supply continuity of bonding material. #### First shipment date of changed product **Key:** first_ship **Type:** date **Default:** 2027-02-01 #### Samples available from **Key:** sample_date **Type:** date **Default:** 2026-12-01 #### Qualification plan summary **Key:** qual **Type:** textarea **Default:** Qualification per AEC-Q100 change guidelines: preconditioning MSL3, HAST, temperature cycling, HTSL, wire bond pull and shear, and electrical characterization on three lots. #### Contact **Key:** contact **Type:** text **Default:** Product quality, pcn@example.com **Blocks:** #### Product / Process Change Notification **Body:** PCN number: {{pcn_no}} Issued by: {{supplier}} Issue date: {{issue_date}} Change type: {{change_type}} #### Affected Products **Body:** {{affected_parts}} #### Description of Change **Body:** {{description}} Reason for change: {{reason}} #### Impact Assessment **Table:** **Columns:** - Area - Impact (Yes / No) - Comment **Rows:** **0:** Form, fit and function **0:** Datasheet parameters **0:** Reliability **0:** Package marking or traceability **0:** Moisture sensitivity level **0:** Soldering or board assembly profile #### Qualification Plan **Body:** {{qual}} #### Timeline **Table:** **Columns:** - Milestone - Date **Rows:** **0:** Samples available **1:** {{sample_date}} **0:** Qualification report available **0:** Customer acknowledgment requested by **0:** First shipment of changed product **1:** {{first_ship}} #### Contact and Acknowledgment **Body:** Questions: {{contact}} If no objection is received within the notification period, the change is considered accepted. #### Approvals **Signatures:** - Product engineering - Quality manager - Customer acknowledgment **Notes:** JEDEC J-STD-046 and customer agreements define notification periods and required content. Notification periods and the acceptance wording are commercial and legal terms, so confirm them against your quality agreements. This template is a starting point, not legal advice. ## Content **Intro:** When a chip supplier changes a wafer process, assembly site or bond material, customers are owed a written notification. This template structures a PCN so that the change, impact, qualification and timeline are clear and complete. **Sections:** #### How to use the PCN template **Body:** Pick the change type and list every affected part number, including temperature grades and package variants. Describe the change in physical terms: what material, process or location changes and what does not. State the reason in plain language, then summarize the qualification plan with the tests and number of lots. Complete the impact table by hand or leave it for engineering to finish. Add the sample and first shipment dates, export to PDF or Word and send to customers. Keep the acknowledgment line so you can track responses. **Bullets:** - List every affected orderable part number - Say what does not change as well - Put real dates, not 'TBD' - Track customer acknowledgments #### What customers look for **Body:** Customer quality engineers read a PCN for three things: does it change form, fit or function, what evidence supports the claim that it does not, and when do they need to act. Automotive customers working under IATF 16949 and AEC-Q100 expect a change to be evaluated against the qualification guidelines and may require sample parts or a PPAP resubmission. Industrial and military customers often have contractual rights to approve changes. A clear, specific PCN shortens their review and reduces back-and-forth questions. #### Qualification evidence **Body:** The qualification plan should map to the risk of the change. A bond wire material change tests wire bond reliability with HAST, temperature cycling and high temperature storage, along with bond pull and shear. A fab site transfer adds electrical characterization across lots, process matching data and reliability tests. A mold compound change emphasizes moisture sensitivity, preconditioning and delamination checks. State the lots, sample sizes and standards referenced, and commit to delivering the report by a date so customers can plan. #### Common mistakes **Body:** The most common errors are vague descriptions such as 'minor process improvement', missing part numbers, and dates that slip without a revised notice. Another is bundling several unrelated changes into one PCN so customers cannot assess each one. Failing to update traceability or marking information also causes problems on the customer's receiving line. If dates move, issue an update referencing the original PCN number rather than sending a new unrelated notice. **Cta:** If PCN tracking and customer-impact lookup need to be searched across your ERP and quality records, Netray can set that up privately. **Faq:** #### How much notice must be given for a PCN? **Answer:** It depends on the customer agreement and the standard referenced. JEDEC J-STD-046 suggests a notification period of 90 days for many change types, but contracts can require more. Always check your agreements. #### Does every change need a PCN? **Answer:** Not every change, but anything that could affect form, fit, function, quality or reliability generally does. Many suppliers define a change classification matrix. When unsure, treat the change as notifiable. #### What is the difference between a PCN and a PDN? **Answer:** A PCN announces a change to a product or process. A PDN, or product discontinuance notification, announces end of life. Some companies use PCN for both, so follow your own naming and the terms in customer contracts. #### Can I attach the qualification report? **Answer:** Yes, and customers often prefer it. If the report is not ready when the PCN is issued, state the planned availability date in the timeline and send it as soon as it is approved. ## Search terms PCN template semiconductor, process change notification form, product change notification template, JESD46 PCN, fab process change notice, die shrink PCN template, supplier change notification electronics, assembly site change PCN --- Talk to an engineer: https://netray.co/contact?intent=erp_ai | Machine catalog: https://netray.co/agent/catalog.json