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IC Package Type Reference (SOIC, QFN, BGA, TSSOP, QFP)

Package names turn up on every BOM line and distributor listing, but they are easy to confuse: SOIC, SSOP and TSSOP differ by pitch and height, and QFN and QFP differ by whether leads are visible. This reference lists common package types with mounting, lead style and typical pitch.

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Package	Full name	Mounting	Lead or terminal style	Common pitch	Process note
DIP	Dual in-line package	Through hole	Two rows of pins	2.54 mm	Wave or hand solder; legacy and sockets
SOIC	Small outline integrated circuit	Surface mount	Gull-wing, two sides	1.27 mm	Easy to inspect and rework
SSOP	Shrink small outline package	Surface mount	Gull-wing, two sides	0.65 mm	Tighter pitch than SOIC; watch bridging
TSSOP	Thin shrink small outline package	Surface mount	Gull-wing, two sides	0.65 mm (0.5 mm also common)	Thinner body; common for logic and analog
MSOP	Mini small outline package	Surface mount	Gull-wing, two sides	0.5 to 0.65 mm	Also called VSSOP by some makers
SOT-23	Small outline transistor	Surface mount	Three to six gull-wing leads	0.95 mm	Transistors, diodes and small regulators
SOT-223	Small outline transistor 223	Surface mount	Three leads and a tab	2.3 mm	Tab spreads heat; used for linear regulators
TO-220	Transistor outline 220	Through hole	Three leads and a metal tab	2.54 mm	Heatsink mounting for power parts
TO-252 (DPAK)	Transistor outline 252	Surface mount	Leads and a solderable tab	2.28 mm	Power MOSFETs and regulators
TO-263 (D2PAK)	Transistor outline 263	Surface mount	Leads and a solderable tab	2.54 mm	Larger surface mount power package
PLCC	Plastic leaded chip carrier	Surface mount or socket	J-lead, four sides	1.27 mm	Legacy memory and logic
QFP	Quad flat package	Surface mount	Gull-wing, four sides	0.4 to 1.0 mm	Microcontrollers; coplanarity matters
LQFP	Low-profile quad flat package	Surface mount	Gull-wing, four sides	0.4 to 0.8 mm	1.4 mm body is typical
TQFP	Thin quad flat package	Surface mount	Gull-wing, four sides	0.4 to 0.8 mm	1.0 mm body is typical
QFN	Quad flat no-lead	Surface mount	Pads on the underside edge	0.4 to 0.65 mm	Exposed pad needs void control; no visible fillet
DFN	Dual flat no-lead	Surface mount	Pads on two sides underneath	0.4 to 0.65 mm	Small regulators and memory
BGA	Ball grid array	Surface mount	Solder balls in a grid	0.5 to 1.27 mm	Needs X-ray inspection; moisture sensitive
LGA	Land grid array	Surface mount or socket	Flat pads in a grid	0.5 to 1.27 mm	Paste printing accuracy is critical
WLCSP	Wafer-level chip-scale package	Surface mount	Bumps on the die	0.35 to 0.5 mm	Bare die edges; handle carefully
CSP	Chip-scale package	Surface mount	Ball or land array	0.4 to 0.8 mm	Package is close to die size

Pitches and body heights are typical ranges. Standards bodies such as JEDEC register outlines and manufacturers add their own variants, so always use the exact outline drawing from the datasheet when ordering or designing a land pattern.

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How to use the package reference

Search for the acronym on your BOM and read across to what it means physically. Buyers use it to judge whether a proposed alternate fits the same footprint, and process engineers use it to anticipate inspection and rework needs. Pitch and lead style are the quickest way to tell whether two similarly named packages can share a land pattern.

Search by acronym, full name or mounting type
Compare pitch before assuming a drop-in replacement
Export the table for supplier onboarding documents

How packages are grouped

Through hole packages such as DIP and TO-220 pass leads through the board. Surface mount leaded packages such as SOIC and QFP have gull-wing leads that show a solder fillet. No-lead packages such as QFN and DFN have pads underneath, and array packages such as BGA and LGA hide every joint under the body. The more hidden the joint, the more you depend on process control and X-ray rather than visual inspection.

What it means for sourcing

Package families are sometimes listed with the same name but different outlines, such as several QFN variants with different body sizes and pad layouts. An alternate with the same acronym is not automatically footprint compatible. Confirm body size, pitch, pad dimensions and exposed pad size against the drawing, and check the moisture sensitivity level for BGA, QFN and similar packages before accepting open stock.

Common mistakes

A frequent error is treating DPAK and D2PAK as interchangeable: they are different sizes. Another is assuming that a thinner package has the same thermal performance, when a smaller body with a smaller exposed pad can run hotter at the same load. Store the full package name and body size in the item master rather than only a short acronym.

Frequently Asked Questions

What is the difference between QFN and QFP?

QFP has gull-wing leads that extend from the body on four sides, so joints are visible. QFN has flat pads under the body edge with no leads, giving a smaller footprint but joints that are harder to inspect.

Are SOIC, SSOP and TSSOP interchangeable?

No. They differ in lead pitch and body width, so they need different land patterns. Treat each as a separate footprint unless the manufacturer states a common outline.

Why do BGA parts need X-ray inspection?

The solder balls sit under the body, so bridging, voids and opens cannot be seen from the side. X-ray or functional test is how those joints are checked in production.

Does package name tell me the moisture sensitivity level?

Not directly. Moisture sensitivity depends on the molding compound and package construction, and is shown on the dry-pack label and datasheet. Many BGA and QFN parts are sensitive, so read the label.

If package data is inconsistent across your item master, we can build a private agent that reads your ERP and supplier files and flags parts whose package descriptions disagree.

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